工厂英文经典知识缩写_电子工厂常见英文缩写

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工厂英文经典知识缩写

工厂英文经典知识缩写

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免费体验史上最牛英语口语学习,太平洋英语www.daodoc.com Design change notice DES Deselect all DFA Design For Aembly DFBA Design for Board Aembly DFDS Design for Demand Supply DfE Design for Environment DFFA Design for Final Aembly DFM Design For Manufacturing(includes DFPT, DFBA, DFFA)DFMEA Design Failure Mode and Effects Analysis DFPT Design for Production Test DG DI-EL.DUPLEXERS Resonator preparing DIR Design Improvement Reports DocMan Type of Lotus Notes database(for documents)DOE Design Of Experiment DOE Design Of Experiment DPM Defects Per Million

工厂英文经典知识缩写

DSB Demand Supply Balance DSN Demand Supplier Network DUT Device Under Test DV Demand Volume DVR E0...E5 Concurrent Engineering(CE)Milestones E0..E5 Concurrent engineering(CE)milestones ECN Engineering Change Notice EFR Early Failure Rate ELMECH Electro Mechanical EMC Electro Magnetic Compatibility EMI Electro Magnetic Interference EMS Environmental Management Sys-tem EN European Norm EoL End of Life EPA ESD protected area ERP es Espoo ESD Electrostatic discharge ESDS Electrostatic discharge sensitive device ESI Early Supplier Involvement ETA Estimate to be arrive EUT Equipment Under Test EV Enclosed volume EVM Enhancements Version Management F Final, document to be archived FA Failure Analysis FAC Fully anechoic chamber FAQ Frequently Asked Questions FAI First article inspection FEM Finite Element Modelling FFR Field Failure Rate FIL Filter..FIML Fabric Inmold Labeling, same with CIM Custom In Mould FIT Failures in Time FMEA Failure Mode and Effect Analysis FOR FOT 第一次试模 FR Failure Rate G.A.General Aembly Gauge R&R Gauge Repeatability and Reproducibility GCPM GD&T Geometrical Dimensioning & Tolerances

工厂英文经典知识缩写

GRP ground reference plane GRR Gauge Repeatability and Reproducibility HBM Human Body Model HBM Human Body Model –discharge type HCP horizontal coupling plane HIGH Highlight selected hk Hong Kong HUB Warehousing and Shipping functionality location ICDR Integrated Circuit Design Reviews ICDR IC Design Review ID Industrial Design IFR Intrinsic Failure Rate IMD Insert Mold Decoration IME Inject Mold Equipment IML Insert Mold Labeling IML IN MOLD LABELING IPQC In Proce Quality Control IPR Intellectual Property Rights ISO International Standardization Organization jk JR&D Joint Research and development KCR Key Component Review KO Kick Off LA License Agreement la Los Angeles LAB Label LCL Lower Control Limit LL Leon Learned LRVP Long Range Volume Plan LSL Lower Specification Limit LSSE Light SW Subcontractor Evaluation M&O Mechanics & Outsourcing M/C machine M3 Global quality database MAR Mechanics Acceptance Report MAR’s Mechanical Acceptance ReportMatCoMa MC Measuring Centre MD Mechanics Desgin MDF Material Data Form MDFs material data forms ME Manufacturing Engineer MECH Mechanics Jyväskylä

’s 工厂英文经典知识缩写

MFI Melt flow index MIS MM Machine Model –discharge type MOR Monthly Operation Review MOSS Visual Quality Criteria’s procedure MPL Material Project Leader MPL / M Material Project Leader / Manager MPL/MPM Material Project Leader/ Manager MPM Material Project Manager MR Measurements Report MRPⅡ

MS Manufacturing Solutions MS Milestone MSA Measurement System Analysis MSID Moisture-Sensitive Identification MSM Mechnical Supplier Management MSM Mechanics Sourcing Manager MTO Make TO Order MTS Mechanical Technology Sourcing MULTIL.PRODUCTS Ceramic powder manuf, Sheet forming, Cutting, Printing, Firing NC non connect NCT NDA Non Disclosure Agreement NET Nokia Networks NET Networks NGP Nokia Global Procees NGS Nokia Global Standards NGSW Nokia Global Supplier Web NMP Nokia Mobile Phones Ltd NOSS Nokia Supplier Status database NPI Nokia Product Integration NPI New Product Introduction NPSQS Nokia Part Specific Quality Standards NRT Nokia Rapid Tooling NSL Nokia Substance List NSM Nokia Supplier Manual NSR Nokia Supplier Requirement NTP Normal temperature and preure, see laboratory environment OAP Original Acceory Partner OCAP Out-of-Control Action Plan OCV Open Circuit Voltage ODM Original Design Manufacturer

工厂英文经典知识缩写

ODM Original Design done by Partner independently OEM Original Equipment Manufacture OEM Original Design done by Nokia OPL Operations Project Leader OQC Outgoing Quality Control ORS Operating Resource Sourcing OT Over time OTD On time delivery ou Oulu PA Proce Aement PA Product Agreement PC Product Creation PC Polycarbonate PCBA PCN Proce Change Notice PCNs product change notification cases PCQE Program Component Quality Engineer PCQM Program Component Quality Manager PD Product Delivery PDM Product Development Manager PDM Product Data Management PDM Product Data Management System PDT Project Development Team PE Product Engineering(used for product in ma production)PFMEA Proce Failure Mode and Effect Analysis PGP Pretty Good Privacy PI Product Implementation PIR PLM Product Line Management PLP Product Lifetime Profitability PLRM Program Loading Road map PM Product Manager PM Purchasing Manager PM Project Manager PM/MP Partner Manufacturing/Manufacturing Partner PMA Project Manager Aistant PMC PMM Program Portfolio Management PMT Project Management Team PO Purchasing Order POKA-YOKE Mistake Proofing POP Package Operation Procedure Pop-Port System connector in NOKIA mobile devices

工厂英文经典知识缩写

POWER AMPS MMIC and/or IC manufacturing Pp, Ppk Proce Performance Indices PPA Product Purchase Agreement PPAP Production Part Approval Proce PPM Product Program Manager ppm Parts per million PQ Proce Qualification PQGFP Package qualification guideline for programs PQM Program Quality Manager PQP Program Quality Plan PQP Package Qualification Procedure PR1/2 PTO Package TO Order PV Product Validation PVD Physical Vapor Deposition PWB Printed Wire Board QA quality auren QBR Quarterly Busine Review QC quality control QE Quality Engineer QFD Quality Function Deployment QM quality management QSR Quality System Requirement QTE Quality Technician Engineer QTE Quality and Technology Engineer QTE / QTM Quality Technology Engineer / Manager QTE / QTM Quality Technology Engineer / Manager QTM Quality and Technology Manager QTY Quantity R&D Research and Development R&R Roles and Responsibilities R&T Research and Technology RAM Random Acce Memory Ramp Up/SA REC Reconsider REL Related to RFP Request For Proposal RFQ Request For Quotation RIPS Recently Introduced Product Support RMA Return Material Authorization SA SAC semi anechoic chamber SAW /BAW FILTERS, SAW DUPLEXERS Die wafer manufacturing

工厂英文经典知识缩写

SCP Service Channel Preparation SEM Scanning Electron Microscope SG Save as group SHO Show si Singapore SID SIP Standard Inspection Procedure SLI Supply Line Implementation proce SLM Supply Line Management SLP Supply Line Preparation proce SO Solution Offering SOP Standard Operation Procedure SOW statement of work SPC Statistical Proce Control SPPM Senior Product Program Manager SPR Standard Product Requirement(Nokia)SQA Supplier Quality Aurance SQC statistical quality control SQE Supply Quality Engineer SQM Supply Quality Manager sample size STA Short Term Availability SVP Senior Vice President SW Software sy Sydney TCRM Technology Competence Roadmap TEC Technology Platform to Tokyo TP Technology Platform TPE TPR Technical Product Requirement TPU tre Tampere U Update, all updated documents that are not final U/I Voltage / Current U/I Voltage / Current UCL Upper Control Limit UG Use group UI User Interface ul Ulm vc VancouverVCO IC manufacturing(discrete transistors, other ICs)VCTCXO Crystal wafer and IC(LSI-VCTCXO)manufacturing

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工厂英文经典知识缩写

VIS Visible VPQCT Volume Production Quality Control Test VQD Visual Quality Engineer VQE Visual Quality Engineer VQR Visual Quality Requirements WBS Work Breakdown Structure

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